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PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS

contributor authorDLA - CC - DLA Land and Maritime
date accessioned2017-09-04T18:47:39Z
date available2017-09-04T18:47:39Z
date copyright41254
date issued2012
identifier otherKMQGBFAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=autho54037D839D40527361598F1EFDEC014A/handle/yse/228863
description abstractThis specification covers the generic performance requirements for single and double sided (one or two conductor layers) printed wiring boards (hereafter designated printed board) with or without plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting (see 6.1). The printed board may contain an external heat sink.Intended Use: This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resins) printed boards of single or double sided conductor layers. The printed boards will use soldering for component mounting and may or may not have plated–through holes or metal backing materials. Printed boards of other base material types or construction styles can be tested or verified to the performance requirements contained in this document; however, the performance parameters of other MIL–PRF–31032 performance specifications sheets may be more suited for verifying those designs.
languageEnglish
titleMIL-PRF-31032/6Anum
titlePRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED–THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONSen
typestandard
page40
statusActive
treeDLA - CC - DLA Land and Maritime:;2012
contenttypefulltext


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