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Blank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipment

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T18:17:07Z
date available2017-09-04T18:17:07Z
date copyright10/01/1991 (R 1997)
date issued1997
identifier otherHOODCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/199999
description abstractThe Chip Carrier Sockets of assessed quality covered by this detail specification shall have:
a) Maximum enclosure of (maximum length, width and height dimensions).
b) A rated voltage not exceeding _ volts (rms).
c) A rated current not exceeding _ ampere per pin.
OBJECT
The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Leadless Type A, B or D Packages described herein by the EIA. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
languageEnglish
titleECA 540AA00num
titleBlank Detail Specification for Chip Carrier Sockets for Leadless Type A, B or D Chip Carriers for Use in Electronic Equipmenten
typestandard
page20
statusActive
treeECIA - Electronic Components Industry Association:;1997
contenttypefulltext


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