ECA EIA-540ABAA

Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T16:11:39Z
date available	2017-09-04T16:11:39Z
date copyright	03/01/1991 (R 1997)
date issued	1997
identifier other	SMPKCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/74835
description abstract	The Chip Carrier Sockets of assessed quality covered by this detail specification shall have: a) Maximum enclosure dimensions that include cover and latching hardware as illustrated in Figure 1. b) A working voltage not exceeding 125 volts (rms) c) Current not exceeding 1 ampere per pin. OBJECT The object of this detail specification is to provide all information required for the identification and quality assessment of the Chip Carrier Sockets for Plastic Quad Flat Packages (PQFP) with lead spacings on 0.635 mn (.025l1) and "gullwing" shaped leads. The information, contained herein or by reference, is complete and sufficient for inspection purposes.
language	English
title	ECA EIA-540ABAA	num
title	Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)	en
type	standard
page	17
status	Active
tree	ECIA - Electronic Components Industry Association:;1997
contenttype	fulltext