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Passive Electronic Component Parts, Test Methods for; Method 10: Effect of Soldering

contributor authorECIA - Electronic Components Industry Association
date accessioned2017-09-04T16:34:28Z
date available2017-09-04T16:34:28Z
date copyright28764
date issued1978
identifier otherUXJPCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoCA5893FD081D527369727A00D52FAB6A/handle/yse/97974
description abstractPURPOSE
This test is performed to determine the effect of normal soldering operations on component parts. Excessive changes in electrical characteristics or mechanical damage to a component part are often caused by the short-time application of high heat, such as is applied to integral component terminastions by a soldering iron or a solder-bath dip in assembly operations. The effect of soldering test is intended to simulate these manufacturing conditions and detect faults in component parts which otherwise may not be noticed until after final equipment assembly.
NOTE 1: (For a test for determining the ability of component part terminations to accept solder, see EIA Standard RS-178-A, Solderability Test Standard.)
NOTE 2: (A recommended solder is one in accordance with ASTM B32, Grade A, having a nominal composition of 60% tin and 40% lead.)
languageEnglish
titleECA 186-10Enum
titlePassive Electronic Component Parts, Test Methods for; Method 10: Effect of Solderingen
typestandard
page4
statusActive
treeECIA - Electronic Components Industry Association:;1978
contenttypefulltext


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