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MSFC-SPEC-3659
PROCESS SPECIFICATION FOR ELECTRICAL BONDING
Organization:
MSFC - NASA - MSFC - Marshall Space Flight Center
Year: 2012
Abstract: This document establishes criteria for the processes involved in electrical bonding of semipermanent, metal-to-metal joints (joints held together by bolts, rivets, clamps, etc.) and indirect bonds for equipment and elements manufactured at the Marshall Space Flight Center (MSFC).
There are two types of electrical bonds: direct and indirect. Direct bonds are metal-to-metal joints provided by welding, riveting or bolting. Indirect bonds are connected through a strap or jumper. Joints formed by welding, brazing or sweating are inherently bonded provided that proper procedures are followed to ensure no impurities or imperfections are incorporated in the joint.
Purpose
This document has two purposes:
1. To provide a minimum set of process control requirements to be used in implementing electrical bonds.
2. To provide a specification for callout on mechanical drawings.
There are two types of electrical bonds: direct and indirect. Direct bonds are metal-to-metal joints provided by welding, riveting or bolting. Indirect bonds are connected through a strap or jumper. Joints formed by welding, brazing or sweating are inherently bonded provided that proper procedures are followed to ensure no impurities or imperfections are incorporated in the joint.
Purpose
This document has two purposes:
1. To provide a minimum set of process control requirements to be used in implementing electrical bonds.
2. To provide a specification for callout on mechanical drawings.
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| contributor author | MSFC - NASA - MSFC - Marshall Space Flight Center | |
| date accessioned | 2017-09-04T17:51:57Z | |
| date available | 2017-09-04T17:51:57Z | |
| date copyright | 02/08/2012 | |
| date issued | 2012 | |
| identifier other | FARHUEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=a/handle/yse/175127 | |
| description abstract | This document establishes criteria for the processes involved in electrical bonding of semipermanent, metal-to-metal joints (joints held together by bolts, rivets, clamps, etc.) and indirect bonds for equipment and elements manufactured at the Marshall Space Flight Center (MSFC). There are two types of electrical bonds: direct and indirect. Direct bonds are metal-to-metal joints provided by welding, riveting or bolting. Indirect bonds are connected through a strap or jumper. Joints formed by welding, brazing or sweating are inherently bonded provided that proper procedures are followed to ensure no impurities or imperfections are incorporated in the joint. Purpose This document has two purposes: 1. To provide a minimum set of process control requirements to be used in implementing electrical bonds. 2. To provide a specification for callout on mechanical drawings. | |
| language | English | |
| title | MSFC-SPEC-3659 | num |
| title | PROCESS SPECIFICATION FOR ELECTRICAL BONDING | en |
| type | standard | |
| page | 13 | |
| status | Active | |
| tree | MSFC - NASA - MSFC - Marshall Space Flight Center:;2012 | |
| contenttype | fulltext |