IPC 9701A

Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

contributor author	IPC - Association Connecting Electronics Industries
date accessioned	2017-09-04T17:48:58Z
date available	2017-09-04T17:48:58Z
date copyright	02/01/2006
date issued	2006
identifier other	ESQBJBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/172179
description abstract	This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures. In addition, it provides an approximate means of relating the results from these performance tests to the reliability of solder attachments for the use environments and conditions of electronic assemblies. Purpose The purpose of this document is: • To provide confidence that the design and the manufacturing/assembly processes create a product that is capable of meeting its intended goals. • To permit the analytical prediction of reliability based on a generic database and technical understanding. • To provide standardized test methods and reporting procedures.
language	English
title	IPC 9701A	num
title	Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments	en
type	standard
page	36
status	Active
tree	IPC - Association Connecting Electronics Industries:;2006
contenttype	fulltext