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Insulation and Moisture Resistance, Flexible Base Dielectric

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:57:32Z
date available2017-09-04T17:57:32Z
date copyright05/01/1988
date issued1988
identifier otherFPDRCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/180663
description abstractThis test method defines the procedures for determining the moisture and insulation resistance of a copper foil clad flexible dielectric material. The moisture resistance test is performed for the purpose of evaluating, in an accelerated manner, the resistance of materials to the deteriorative effects of high humidity and heat conditions, typical of tropical environments.
languageEnglish
titleIPC TM-650 2.6.3.2Bnum
titleInsulation and Moisture Resistance, Flexible Base Dielectricen
typestandard
page4
statusActive
treeIPC - Association Connecting Electronics Industries:;1988
contenttypefulltext


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