IPC TM-650 2.6.10A
X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods
contributor author | IPC - Association Connecting Electronics Industries | |
date accessioned | 2017-09-04T17:59:53Z | |
date available | 2017-09-04T17:59:53Z | |
date copyright | 08/01/1997 | |
date issued | 1997 | |
identifier other | FVHXCAAAAAAAAAAA.pdf | |
identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/182963 | |
description abstract | This non-destructive inspection method is needed to ascertain the following conditions: a. Innerlayer shift is within acceptable tolerances. b. One or more inner layers have not been reversed. c. Drilled holes are aligned with pads to the extent that any break-out is within acceptable tolerances. d. The minimum distance between a drilled hole and a ground plane clearance is within acceptable tolerances. The test method will entail passing X-rays through the test specimen and converting the transmitted X-ray image into a visual image through the use of either X-ray film or a flouro- scopic (real time) device. Cautionary notes: The construction of the multilayer with respect to; number of layers, thickness of copper and presence other metals such as heat sinks (e.g. Invar), will determine the power and sensitivity of the X-ray apparatus which can be used. All X-ray apparatus should be registered with the appropriate state or regional Radiation Control agency. A radiation safety program should be implemented. | |
language | English | |
title | IPC TM-650 2.6.10A | num |
title | X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods | en |
type | standard | |
page | 2 | |
status | Active | |
tree | IPC - Association Connecting Electronics Industries:;1997 | |
contenttype | fulltext |