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X-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methods

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T17:59:53Z
date available2017-09-04T17:59:53Z
date copyright08/01/1997
date issued1997
identifier otherFVHXCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/182963
description abstractThis non-destructive inspection method is needed to ascertain the following conditions:
a. Innerlayer shift is within acceptable tolerances.
b. One or more inner layers have not been reversed.
c. Drilled holes are aligned with pads to the extent that any break-out is within acceptable tolerances.
d. The minimum distance between a drilled hole and a ground plane clearance is within acceptable tolerances.
The test method will entail passing X-rays through the test specimen and converting the transmitted X-ray image into a visual image through the use of either X-ray film or a flouro- scopic (real time) device.
Cautionary notes:
The construction of the multilayer with respect to; number of layers, thickness of copper and presence other metals such as heat sinks (e.g. Invar), will determine the power and sensitivity of the X-ray apparatus which can be used. All X-ray apparatus should be registered with the appropriate state or regional Radiation Control agency.
A radiation safety program should be implemented.
languageEnglish
titleIPC TM-650 2.6.10Anum
titleX-Ray (Radiography), Multilayer Printed Wiring Printed Board Test Methodsen
typestandard
page2
statusActive
treeIPC - Association Connecting Electronics Industries:;1997
contenttypefulltext


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