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IPC TM-650 2.3.23B
Cure (Permanency) Thermally Cured Solder Masks
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:01:05Z | |
| date available | 2017-09-04T18:01:05Z | |
| date copyright | 02/01/1988 | |
| date issued | 1988 | |
| identifier other | ABCZCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/184140 | |
| description abstract | This test method covers the cure, or permanence, testing of thermally cured solder mask (solder resist) organic coatings. Solder masking is the application of either a liquid film or dry film coating on all types of laminates and circuits. The coating is applied where no solder is to appear and, conversely, is omitted where soldering is intended. | |
| language | English | |
| title | IPC TM-650 2.3.23B | num |
| title | Cure (Permanency) Thermally Cured Solder Masks | en |
| type | standard | |
| page | 1 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1988 | |
| contenttype | fulltext |
