Show simple item record

Design Guide for Press Fit Rigid Printed Board Backplanes

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:07:59Z
date available2017-09-04T18:07:59Z
date copyright09/01/1982
date issued1982
identifier otherGQJXCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/190894
description abstractIntroduction
This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical knowledge of the various types of interconnection systems. Also, that the electrical and mechanical properties of the interconnection materials have already been evaluated and selected by the individual companies’ components specification organizations and are approved.
The purpose of this document is to enlarge upon the user’s analysis and approach the design from the fabricators and assemblers with respect to design optimization. This design optimization can have a dramatic impact on the life cycle cost of the equipment.
languageEnglish
titleIPC D-422num
titleDesign Guide for Press Fit Rigid Printed Board Backplanesen
typestandard
page27
statusActive
treeIPC - Association Connecting Electronics Industries:;1982
contenttypefulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record