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IPC TA-722
Technology Assessment of Soldering
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:21:52Z | |
| date available | 2017-09-04T18:21:52Z | |
| date copyright | 01/01/1990 | |
| date issued | 1990 | |
| identifier other | HZVAKAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/204291 | |
| description abstract | "An Introduction to Soldering" By R.J. Klein Wassink, Phillips Center for Manufacturing Technology, Eindoven, The Netherlands This article reviews various aspects of soldering as they relate to printed wiring assemblies. It describes soldering for electronic boards and components, and compares soldering to other joining techniques. This article is a good overview for the engineer who needs a brief introduction to soldering. | |
| language | English | |
| title | IPC TA-722 | num |
| title | Technology Assessment of Soldering | en |
| type | standard | |
| page | 479 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1990 | |
| contenttype | fulltext |
