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IPC TR-578

Leading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boards

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:27:39Z
date available2017-09-04T18:27:39Z
date copyright09/01/1984
date issued1984
identifier otherIONVCAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/209838
description abstractOBJECTIVE
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:
  • To evaluate the state-of-the-art in the international printed wiring board industry for fabrication of high density, double sided, rigid bare copper boards.
  • Collect data on different manufacturing methods and substrates used to fabricate printed wiring boards.
  • Include all recognized printed wiring board manufacturing methods: i.e., subtractive, thin foil, semi-additive and fully-additive.
  • Determine the reliability and quality of the boards producedu sing recognized industry testing practices and procedures.
languageEnglish
titleIPC TR-578num
titleLeading Edge Manufacturing Technology Report Results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double Sided Printed Wiring Boardsen
typestandard
page100
statusActive
treeIPC - Association Connecting Electronics Industries:;1984
contenttypefulltext


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