درباره ما
IPC TM-650 2.4.1.2
Adhesion of Conductors on Hybrid Substrates
| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T18:27:48Z | |
| date available | 2017-09-04T18:27:48Z | |
| date copyright | 32112 | |
| date issued | 1987 | |
| identifier other | IPCVCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;query=authoF237ear369B7AC426159DD6EFDEC9FCD/handle/yse/210038 | |
| description abstract | This method is to determine the adhesion or bonding quality of conductors on hybrid substrates. | |
| language | English | |
| title | IPC TM-650 2.4.1.2 | num |
| title | Adhesion of Conductors on Hybrid Substrates | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1987 | |
| contenttype | fulltext |
