ECA IS-46

Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices

contributor author	ECIA - Electronic Components Industry Association
date accessioned	2017-09-04T16:01:38Z
date available	2017-09-04T16:01:38Z
date copyright	07/01/1987
date issued	1987
identifier other	RLOTCAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;query=authoge2/handle/yse/64844
description abstract	There are two basic processes for soldering surface mount connectors — vapor phase and infra-red. Both apply heat which the total connector systems is exposed to with no insulating medium (e.g. printed circuit boards) between the termination and connector assembly. In addition to heat, the vapor phase system employs a chemical medium (perfluoro-carbon) in a vapor form. Connector materials are exposed to these mediums and thus must withstand both heat and chemical vapors. There are three basic features which must be evaluated prior to a material or connector configuration being acceptable for surface mount process. These factors are: A: Heat Impact B: Dimensional Stability C: Chemical Resistance This procedure establishes a technique to evaluate plastic materials used for connector housings which will be exposed to a vapor phase reflow process.
language	English
title	ECA IS-46	num
title	Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices	en
type	standard
page	5
status	Active
tree	ECIA - Electronic Components Industry Association:;1987
contenttype	fulltext