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Draft BS EN IEC 61189-3-303 Ed.1.0 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on c

25/30511428 DC

contributor authorBSI - British Standards Institution
date accessioned2025-09-30T22:10:24Z
date available2025-09-30T22:10:24Z
date copyright04 August 2025
date issued2025
identifier isbn-
identifier other000000000030511428.pdf
identifier urihttp://yse.yabesh.ir/std;quess=autho1216AF679DDCAC4/handle/yse/347289
languageEnglish
publisherBSI - British Standards Institution
titleDraft BS EN IEC 61189-3-303 Ed.1.0 Test methods for electrical materials, printed board and other interconnection structures and assemblies. Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on cen
title25/30511428 DCnum
typeStandard
page13
statusDraft
treeBSI - British Standards Institution:;2025
contenttypeFulltext


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