JEDEC JESD51-9

Test Boards for Area Array Surface Mount Package Thermal Measurements

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T16:50:01Z
date available	2017-09-04T16:50:01Z
date copyright	07/01/2000
date issued	2000
identifier other	BUJZMAAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/113635
description abstract	This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of ball grid array (BGA) and land grid array (LGA) packages. It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-9 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.
language	English
title	JEDEC JESD51-9	num
title	Test Boards for Area Array Surface Mount Package Thermal Measurements	en
type	standard
page	22
status	Active
tree	JEDEC - Solid State Technology Association:;2000
contenttype	fulltext
subject keywords	Area Array
subject keywords	Test Board
subject keywords	Thermal Measurements