JEDEC JESD22-B116A

Wire Bond Shear Test Method

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T16:17:22Z
date available	2017-09-04T16:17:22Z
date copyright	08/01/2009
date issued	2009
identifier other	BLECOCAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quessionid=2A40ear/handle/yse/80713
description abstract	This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.
language	English
title	JEDEC JESD22-B116A	num
title	Wire Bond Shear Test Method	en
type	standard
page	18
status	Active
tree	JEDEC - Solid State Technology Association:;2009
contenttype	fulltext
subject keywords	Ball Bond
subject keywords	Test Method - Wire Bond Shear
subject keywords	Wire Bond Shear