IEC TS 62647-4

Abstract

This part of IEC 62647, which is a Technical Specification, defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. NOTE 1 IEC TS 62239-1 and EIA-STD-4899 describe the electronic components management program (ECMP). It does not apply to column grid array (CGA) components or chip scale components. This re-balling document addresses two types of configurations. For other configuration types, see Annex A for tailoring. • Configuration 1: A BGA package that will be de-balled and then re-balled with tin-lead balls compatible with a tin-lead soldering assembly process. • Configuration 2: A BGA package that will be de-balled and then re-balled with Pb-free balls compatible with a Pb-free soldering assembly process. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process. This document is intended to be used by de-balling/re-balling providers and customers, typically avionics original equipment manufacturers (OEM); it defines the requirements for reballing providers who are providing services to the aerospace, defence, high performance and high reliability electronics industry. Requirements for new BGA component part number qualification are also included. This document identifies the need for the creation of new part numbers for re-balled BGA components, covers process and testing requirements for the de-balling/re-balling process and encourages the automated processes due to the ability to control the process. Companies engaged in re-balling are supposed to have the necessary knowledge, experience and tools, and to customize if needed their own methods for defining a de-balling/re-balling process that meets the requirements in this document. Each customer determines the applicability of this document and the need for full replacement of the existing solder balls. Some applications can have unique requirements that exceed the scope of this document and are therefore specified separately. This document is not intended to address all procedures and processes associated with a deballing/ re-balling facility; it is assumed there are management, quality, manufacturing, safety, calibration and training processes/procedures in place as well as all the necessary tools and equipment to accomplish the work. NOTE 2 For the purposes of this document, if the term “BGA” is used alone, it is stated as “BGA component". NOTE 3 The replacement, for example, of damaged tin-lead balls by new tin-lead balls or damaged Pb-free balls by new Pb-free balls is not specifically addressed in this document but some parts of the document and the table for tailoring the requirements (see Annex A) can be used for supporting the operations. Although developed for the avionics industry, this process can be applied by other industrial sectors at their discretion.