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IEC 62047-30
Semiconductor devices – Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film - Edition 1.0
| contributor author | IEC - International Electrotechnical Commission | |
| date accessioned | 2018-07-31T09:58:48Z | |
| date available | 2018-07-31T09:58:48Z | |
| date copyright | 2017.09.01 | |
| date issued | 2017 | |
| identifier other | WOTECGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=31064A12890E9/handle/yse/264831 | |
| description abstract | This part of IEC 62047 specifies measuring methods of electro-mechanical conversion characteristics of piezoelectric thin film used for micro sensors and micro actuators, and its reporting schema to determine the characteristic parameters for consumer, industry or any other applications of piezoelectric devices. This document applies to piezoelectric thin films fabricated by MEMS process. | |
| language | English | |
| title | IEC 62047-30 | num |
| title | Semiconductor devices – Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film - Edition 1.0 | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | IEC - International Electrotechnical Commission:;2017 | |
| contenttype | fulltext |
