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BS EN IEC 63378-2-2 Thermal standardization on semiconductor packages. Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

BS EN IEC 63378-2-2

contributor authorBSI - British Standards Institution
date accessioned2025-09-30T21:47:31Z
date available2025-09-30T21:47:31Z
date copyright07 February 2025
date issued2025
identifier isbn-
identifier other000000000030510059.pdf
identifier urihttp://yse.yabesh.ir/std;quessionid=31064A12890E9/handle/yse/347048
languageEnglish
publisherBSI - British Standards Institution
titleBS EN IEC 63378-2-2 Thermal standardization on semiconductor packages. Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packagesen
titleBS EN IEC 63378-2-2num
typeStandard
page29
statusCurrent
treeBSI - British Standards Institution:;2025
contenttypeFulltext


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