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JEDEC JESD59
Bond Wire Modeling Standard
| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T16:50:24Z | |
| date available | 2017-09-04T16:50:24Z | |
| date copyright | 06/01/1997 | |
| date issued | 1997 | |
| identifier other | WNUJCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;quessionid=4703-Sta081D206/handle/yse/113970 | |
| description abstract | This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration. | |
| language | English | |
| title | JEDEC JESD59 | num |
| title | Bond Wire Modeling Standard | en |
| type | standard | |
| page | 14 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;1997 | |
| contenttype | fulltext | |
| subject keywords | Bond Wire - Modeling | |
| subject keywords | Modeling - Bond Wire |
