JEDEC JEP149

Application Thermal Derating Methodologies

contributor author	JEDEC - Solid State Technology Association
date accessioned	2017-09-04T16:34:23Z
date available	2017-09-04T16:34:23Z
date copyright	38292
date issued	2004
identifier other	UXCQGBAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;quessionid=4703-Sta081D206/handle/yse/97858
description abstract	This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies.
language	English
title	JEDEC JEP149	num
title	Application Thermal Derating Methodologies	en
type	standard
page	18
status	Active
tree	JEDEC - Solid State Technology Association:;2004
contenttype	fulltext
subject keywords	Application
subject keywords	Derating
subject keywords	Junction Temperature
subject keywords	Thermal