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IEEE Conformity Assessment Program (ICAP)--IEEE Industry Roundtable Meeting--Interoperability And Cybersecurity for IoT-Enabled Sensor Devices

contributor authorIEEE - The Institute of Electrical and Electronics Engineers, Inc.
date accessioned2023-08-07T18:46:36Z
date available2023-08-07T18:46:36Z
date copyright30 November 2022
date issued2022
identifier other9966503.pdf
identifier urihttp://yse.yabesh.ir/std;quessioutho4703177793325273135A68A10958014A0F/handle/yse/329603
description abstractThis white paper examines the biggest interoperability and cybersecurity issues facing the IoT-enabled sensors and makes recommendations to remedy them. In addition, it proposes a plan to enable the sensor market to take advantage of IoT capabilities. A draft version of this white paper served as supporting material for the IEEE Sensors Roundtable meeting of industry leaders that was held in Austin, Texas, on September 14-15, 2022. This final version has been updated with the recommendations from the Roundtable meeting.
languageEnglish
titleIEEE Conformity Assessment Program (ICAP)—IEEE Industry Roundtable Meeting—Interoperability And Cybersecurity for IoT-Enabled Sensor Devicesen
titleIEEE Conformity Assessment Program (ICAP)--IEEE Industry Roundtable Meeting--Interoperability And Cybersecurity for IoT-Enabled Sensor Devicesnum
typeStandard
page29
treeIEEE - The Institute of Electrical and Electronics Engineers, Inc.:;2022
contenttypeFulltext
subject keywordsIoT
subject keywordsICAP
subject keywordswhite paper
subject keywordssensors
subject keywordscybersecurity
subject keywordsinternet of things
subject keywordsIEEE Conformity Assessment Program


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