درباره ما
SMD-5962-94667
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON
| contributor author | DLA - CC - DLA Land and Maritime | |
| date accessioned | 2017-09-04T18:04:26Z | |
| date available | 2017-09-04T18:04:26Z | |
| date copyright | 06/12/1995 | |
| date issued | 1995 | |
| identifier other | GGYYDAAAAAAAAAAA.pdf | |
| identifier uri | https://yse.yabesh.ir/std/handle/yse/187381 | |
| description abstract | This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. The PIN shall be as shown in the following example: Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. The device type(s) shall identify the circuit function as follows: Minimum Propagation delay, Device type Generic number Circuit function operating period HCLK to DOUTENA 01 RH-1750 Microprocessor, multichip module (MCM) 40 ns max 8.0 ns to 33 ns 02 RH-1750 Microprocessor, multichip module (MCM) 55 ns max 8.0 ns to 33 ns 03 RH-1750 Microprocessor, multichip module (MCM) 55 ns max 8.0 ns to 36 ns 04 RH-1750 Microprocessor, multichip module (MCM) 50 ns max 8.0 ns to 33 ns The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535 The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Y see figure 1 200 Quad flat package The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. Supply voltage range (VDD) . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . . −0.5 V dc to VDD + 0.5 V dc DC output voltage range (VOUT) . . . . . . . . . . . . . −0.5 V dc to VDD + 0.5 V dc DC input current (IIN) 3/ . . . . . . . . . . . . . . . . ±50 mA DC output current (IOUT) 4/ . . . . . . . . . . . . . . . ±50 mA Output voltage applied in high impedance state . . . . . −0.5 V dc to VDD + 0.5 V dc Power dissipation (PD) . . . . . . . . . . . . . . . . . 4.87 W (peak) Lead temperature (soldering, 5 seconds) . . . . . . . . . +270°C Maximum junction temperature (TJ) . . . . . . . . . . . . 150°C Thermal resistance. junction-to-case (θJC) . . . . . . . 1.0°C/W Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage range (VDD) . . . . . . . . . . . . . . . 4.5 V dc to 5.0 V dc DC input voltage range (VIN) . . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc DC output voltage range (VOUT) . . . . . . . . . . . . . −0.3 V dc to VDD + 0.3 V dc DC input current (IIN) 3/ . . . . . . . . . . . . . . . . ±10 mA DC output current (IOUT) 4/ . . . . . . . . . . . . . . . ±12 mA Capacitive output load (CL) 5/ . . . . . . . . . . . . . 50 pF Case operating temperature range (TC) . . . . . . . . . . −55°C to +125°C Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 98.4 percent Intended Use: Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. Device class Q devices will replace device class M devices. | |
| language | English | |
| title | SMD-5962-94667 | num |
| title | MICROCIRCUIT, DIGITAL, RADIATION HARDENED, 1750 CHIP SET, MULTICHIP MICROCIRCUIT, SILICON | en |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | DLA - CC - DLA Land and Maritime:;1995 | |
| contenttype | fulltext |
