IEEE 1156.1

Abstract

This specification is designed for use in conjunction with other families of documents such as IEEE Std1101.x, IEEE Standard for Mechanical Core Specifications for Microcomputers; IEEE Std 896.x, IEEE Standard Backplane Bus Specification for Multiprocessor Architectures: Futurebus+; IEEE Std 1596-1992, IEEE Standard for Scalable Coherent Interface (SCI); IEEE Std 1014-1987, IEEE Standard for a Versatile Backplane Bus: VMEbus; IEEE Std 1296-1987, IEEE Standard for a High-Performance Synchronous 32-Bit Bus: MULTIBUS&#174;2 II; and IEEE Std 1301- 1991, IEEE Standard for a Metric Equipment Practice for Microcomputers&#8212;Coordinating Document. <br>This standard is intended to be used as a core specification. It contains the minimum environmental withstand conditions that are applicable to computer modules/circuit boards and all of the components attached to those modules. It has been created to provide general environmental withstand conditions for one or more of the previously listed computer buses or interconnect standards. It may also apply to electronic equipment in general. <br>While this document was specifically created for use with IEEE computer bus standards, nothing herein is intended to restrict its use for other applications, where applicable. A supplier and user may agree to more or less restrictive environmental specifications than those listed in this standard. However, if their specifications are less restrictive than those listed herein, neither supplier nor user may claim conformance to this document. <br><strong>Purpose</strong> <br>The purpose of this standard is to provide a common set of specifications for physical integrity and environmental performance levels for computer modules and their components. <br>It is the responsibility of the system designer to evaluate the relationship between this module-level environmental specification and the system-level environmental specification for the enclosure that contains the modules. For example, in some applications, the modules are conduction cooled and a system-level thermal "model" is required to determine the relationship between the module's heat sink and the system-level cooling medium.