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INSULATING RESIN, SOLVENTLESS, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SH, CLASS 155 TO 200 THERMAL CLASS

contributor authorNAVY - SH - Naval Sea Systems Command (Ship Systems)
date accessioned2017-09-04T15:40:28Z
date available2017-09-04T15:40:28Z
date copyright09/21/1993
date issued1993
identifier otherPDXXDAAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/42688
description abstractThis specification is approved for use by all departments and agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of this specification sheet and the issue of the following specification listed in that issue of the Department of Defense Index of Specifications and Standards (DODISS) specified in the solicitation: MIL-I-24092.
languageEnglish
titleMIL-I-24092/7Anum
titleINSULATING RESIN, SOLVENTLESS, BAKING, SEMI-RIGID, FOR DIP PROCESSING, GRADE SH, CLASS 155 TO 200 THERMAL CLASSen
typestandard
page3
statusActive
treeNAVY - SH - Naval Sea Systems Command (Ship Systems):;1993
contenttypefulltext


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