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Lessons Learned - Thermal Sensor Installation Failures Remain a Problem

contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T15:42:48Z
date available2017-09-04T15:42:48Z
date copyright01/27/2005
date issued2005
identifier otherBAYCQCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/44978
description abstractAbstract:
There is an extensive history of resistance thermal device (RTD) failures on NASA and DOD missions due to thermally-induced mechanical stress. Recent MER ground and in-flight failures, including some failures in mission critical MER applications, suggest that these devices remain sensitive to variations in the mounting configuration. Perform Package Qualification Verification (PQV) for all critical RTD applications. For non-critical applications, develop standard, flight qualified installations and methods, and track the part pedigree.
languageEnglish
titleNASA-LLIS-1581num
titleLessons Learned - Thermal Sensor Installation Failures Remain a Problemen
typestandard
page3
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;2005
contenttypefulltext
subject keywordsFlight Equipment
subject keywordsHardware
subject keywordsParts
subject keywordsMaterials & Processes
subject keywordsPayloads
subject keywordsSpacecraft
subject keywordsTest & Verification
subject keywordsTest Article


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