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Lessons Learned – Vibration-Induced Failures of Electronic Component Leads as a Result of Improper Mechanical Packaging Design

contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T16:18:12Z
date available2017-09-04T16:18:12Z
date copyright02/11/2002
date issued2002
identifier otherTEVEQCAAAAAAAAAA.pdf
identifier urihttps://yse.yabesh.ir/std/handle/yse/81628
description abstractDescription of Driving Event:
A battery charger design was reported to have experienced catastrophic component failure during vibration testing, resulting in fractured and broken component leads of heatsink-mounted power devices. A photograph of the failed assembly (Fig. 1) clearly showed a pattern of damage consistent with repeated movement and flexure of the components. The primary cause of the unwanted movement was attributed to a design decision, in which the heatsink was allowed to "float" with respect to the printed wiring assembly.
A design change, which mechanically bonded the heatsink and the printed wiring assembly together, significantly reduced the incidence of component lead failures during vibration tests.
A visual examination of sample components supplied to JSC suggested that the use of unapproved tooling and processes during the component lead forming process was a contributing factor to the observed fractured and separated leads, with numerous sample components exhibiting leads with cracks (Fig. 2). Discussions with the vendor indicated that metallic tools (including a screwdriver) were employed to form the leads. Subsequent improvement in tooling and processes resulted in smoothly formed lead bends, without fractures or significant tooling marks.
languageEnglish
titleNASA-LLIS-1202num
titleLessons Learned – Vibration-Induced Failures of Electronic Component Leads as a Result of Improper Mechanical Packaging Designen
typestandard
page2
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;2002
contenttypefulltext
subject keywordsFlight Equipment
subject keywordsHardware
subject keywordsParts Materials & Processes


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