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COMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONE

contributor authorDLA - GS3 - DLA Aviation - Richmond
date accessioned2017-09-04T17:11:55Z
date available2017-09-04T17:11:55Z
date copyright05/15/2012
date issued2012
identifier otherYTRLVEAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/135390
description abstractThis specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal
languageEnglish
titleMIL-DTL-47113Enum
titleCOMPOUND, HEAT SINK, SILICONE AND/OR NON-SILICONEen
typestandard
page11
statusActive
treeDLA - GS3 - DLA Aviation - Richmond:;2012
contenttypefulltext


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