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LEAD PLATING, ELECTRODEPOSITED

contributor authorARMY - MR - Army Research Laboratory, Weapons and Materials Research Directorate
date accessioned2017-09-04T17:53:59Z
date available2017-09-04T17:53:59Z
date copyright02/14/1975
date issued1975
identifier otherFFWJDAAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/177102
description abstractThis specification covers electrodeposited lead plating applied to iron and steel, copper, and copper-rich surfaces (see 6.1).
Lead plating shall be of the following types and classes, as specified (see 6.2):
Type I - without preliminary copper coating
Class 1 - 25 micrometers (0.001 inch) thick lead coating
Class 2 - 13 micrometers (0.0005 inch) thick lead coating
Class 3 - 6 micrometers (0.00025 inch) thick lead coating
Type II - with 0.33 micrometer* (0.000015 inch) thick preliminary copper coating (see 6.1.2)
Class 1 - 25 micrometers (0.001 inch) thick lead coating
Class 2 - 13 micrometers (0.0005 inch) thick lead coating
Class 3 - 6 micrometers (0.00025 inch) thick lead coating Intended Use: Lead coatings are used to prevent corrosion, to prevent galling of metal parts, to improve the performance of bearings and to facilitate soldering. Lead may be plated directly on copper, brass or copper rich alloy surfaces. For steel surfaces, the type II process with a preliminary copper coating should be used to obtain adequate adhesion and corrosion resistance. Type II shall be used for all applications except where the presence of the initial thin copper coating is detrimental to the use. The thin undercoat of copper increases the salt spray resistance of lead coatings varying in thickness from 6 to 25 micrometers (0.00025 to 0.001 inch) by as much as a factor of two as well as improving adhesion of the lead to the steel.
languageEnglish
titleMIL-L-13808Bnum
titleLEAD PLATING, ELECTRODEPOSITEDen
typestandard
page11
statusActive
treeARMY - MR - Army Research Laboratory, Weapons and Materials Research Directorate:;1975
contenttypefulltext


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