Show simple item record

Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T18:50:14Z
date available2017-09-04T18:50:14Z
date copyright38626
date issued2005
identifier otherKUDNDDAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/231632
languageItalian
titleIPC IPC/JEDEC J-STD-033B.1 ITALIANnum
titleHandling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Incorporates Amendment 1: January 2007en
typestandard
page32
statusActive
treeIPC - Association Connecting Electronics Industries:;2005
contenttypefulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record