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JEDEC JESD22-B112A
Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature
| contributor author | JEDEC - Solid State Technology Association | |
| date accessioned | 2017-09-04T15:27:28Z | |
| date available | 2017-09-04T15:27:28Z | |
| date copyright | 40087 | |
| date issued | 2009 | |
| identifier other | AVMXOCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std/handle/yse/28368 | |
| description abstract | The purpose of this test method is to measure the deviation from uniform flatness of an integrated circuit package body for the range of environmental conditions experienced during the surface-mount soldering operation. | |
| language | English | |
| title | JEDEC JESD22-B112A | num |
| title | Package Warpage Measurement of Surface-Mount Integrated Circuits at Elevated Temperature | en |
| type | standard | |
| page | 30 | |
| status | Active | |
| tree | JEDEC - Solid State Technology Association:;2009 | |
| contenttype | fulltext | |
| subject keywords | High Temperature | |
| subject keywords | Measurement | |
| subject keywords | Methodology | |
| subject keywords | Package | |
| subject keywords | Test Method | |
| subject keywords | Warpage |
