Show simple item record

English -- REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIES;
Italian -- Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

contributor authorIPC - Association Connecting Electronics Industries
date accessioned2017-09-04T16:29:49Z
date available2017-09-04T16:29:49Z
date copyright39387
date issued2007
identifier otherUJWSUEAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std/handle/yse/93050
description abstractThis document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance Committee of the IPC. This revision includes expanded coverage for lead free processes, and additional inspection guidelines for operations such as repair that may not have other published criteria. This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly.
languageItalian
titleIPC 7711B/7721B ITALIANnum
titleEnglish -- REWORK, MODIFICATION AND REPAIR OF ELECTRONIC ASSEMBLIESen
titleItalian -- Rilavorazione, Modifica e Riparazione di Assemblati Elettroniciother
typestandard
page376
statusActive
treeIPC - Association Connecting Electronics Industries:;2007
contenttypefulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record