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TIA TSB-144
Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges
Organization:
TIA - Telecommunications Industry Association
Year: 2012
Abstract: The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products.
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| contributor author | TIA - Telecommunications Industry Association | |
| date accessioned | 2017-09-04T17:45:20Z | |
| date available | 2017-09-04T17:45:20Z | |
| date copyright | 04/01/2003 (R 2012) | |
| date issued | 2012 | |
| identifier other | EISWTEAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=autho17/handle/yse/168478 | |
| description abstract | The bulletin is applicable to fiber optic component reliability. The document is written for fiber optic component manufacturers, as well as end-users, and was prepared by TIA Working Group FO-6.3.1, Adhesives Reliability under the cognizance of FO-6.3 SC Subcommittee on Interconnecting Devices and Passive Products. | |
| language | English | |
| title | TIA TSB-144 | num |
| title | Adhesive Bubbles and Voids in Fiber Optic Components: Guidance, Issues and Challenges | en |
| type | standard | |
| page | 24 | |
| status | Active | |
| tree | TIA - Telecommunications Industry Association:;2012 | |
| contenttype | fulltext |