JSA JIS Z 3285

Solder paste for micro-joining-Characteristic test methods for solder paste using fine particles

contributor author	JSA - Japanese Standards Association
date accessioned	2018-10-06T07:11:25Z
date available	2018-10-06T07:11:25Z
date copyright	2017.12.20
date issued	2017
identifier other	AKQCGGAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsein=author:%22NAVY%20-%20YD%20-%20Naval%20Facilities%177ngineering%20Command%226EFDEC9FCD/handle/yse/265372
description abstract	This Japanese Industrial Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 μm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series.
language	English
title	JSA JIS Z 3285	num
title	Solder paste for micro-joining-Characteristic test methods for solder paste using fine particles	en
type	standard
page	26
status	Active
tree	JSA - Japanese Standards Association:;2017
contenttype	fulltext