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JSA JIS Z 3285
Solder paste for micro-joining-Characteristic test methods for solder paste using fine particles
Organization:
JSA - Japanese Standards Association
Year: 2017
Abstract: This Japanese Industrial Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 μm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series.
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| contributor author | JSA - Japanese Standards Association | |
| date accessioned | 2018-10-06T07:11:25Z | |
| date available | 2018-10-06T07:11:25Z | |
| date copyright | 2017.12.20 | |
| date issued | 2017 | |
| identifier other | AKQCGGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=author:%22NAVY%20-%20YD%20-%20Naval%20Facilities%177ngineering%20Command%226EFDEC9FCD/handle/yse/265372 | |
| description abstract | This Japanese Industrial Standard specifies the characteristics test methods for solder paste using fine solder particles with a particle size of symbol 7 and symbol 8 specified in JIS Z 3284-1 (hereafter referred to as solder paste), mainly intended for connection of wiring and components to high-density printed circuit boards with fine wiring (e.g. 60 μm or smaller in minimum conductor width and minimum conductor spacing) used in electronic and communication devices. The test methods specified in this Standard incorporate consideration for the effect of high surface activity of fine solder particles, so that such solder particles can be tested with better precision than when tested using the test methods specified in JIS Z 3284 series. | |
| language | English | |
| title | JSA JIS Z 3285 | num |
| title | Solder paste for micro-joining-Characteristic test methods for solder paste using fine particles | en |
| type | standard | |
| page | 26 | |
| status | Active | |
| tree | JSA - Japanese Standards Association:;2017 | |
| contenttype | fulltext |