JSA JIS Z 3282

Soft solders - Chemical compositions and forms

contributor author	JSA - Japanese Standards Association
date accessioned	2018-10-06T07:11:32Z
date available	2018-10-06T07:11:32Z
date copyright	2017.03.21
date issued	2017
identifier other	ENMHCGAAAAAAAAAA.pdf
identifier uri	http://yse.yabesh.ir/std;jsein=author:%22NAVY%20-%20YD%20-%20Naval%20Facilities%177ngineering%20Command%226EFDEC9FCD/handle/yse/265406
description abstract	This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing lead (hereafter referred to as lead-free solders). NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows. ISO 9453: 2014 Soft solder alloys-Chemical compositions and forms lEC 61190-1-3: 2010 Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (overall evaluation: MOD) In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1.
language	English
title	JSA JIS Z 3282	num
title	Soft solders - Chemical compositions and forms	en
type	standard
page	22
status	Active
tree	JSA - Japanese Standards Association:;2017
contenttype	fulltext