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JSA JIS Z 3282
Soft solders - Chemical compositions and forms
Organization:
JSA - Japanese Standards Association
Year: 2017
Abstract: This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing lead (hereafter referred to as lead-free solders). NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows. ISO 9453: 2014 Soft solder alloys-Chemical compositions and forms lEC 61190-1-3: 2010 Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (overall evaluation: MOD) In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1.
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| contributor author | JSA - Japanese Standards Association | |
| date accessioned | 2018-10-06T07:11:32Z | |
| date available | 2018-10-06T07:11:32Z | |
| date copyright | 2017.03.21 | |
| date issued | 2017 | |
| identifier other | ENMHCGAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsein=author:%22NAVY%20-%20YD%20-%20Naval%20Facilities%177ngineering%20Command%226EFDEC9FCD/handle/yse/265406 | |
| description abstract | This Standard specifies lead-containing soft solders used in the field of general or electric/electronic industries (hereafter referred to as lead-containing solders) and soft solders not containing lead (hereafter referred to as lead-free solders). NOTE: The International Standards corresponding to this Standard and the symbol of degree of correspondence are as follows. ISO 9453: 2014 Soft solder alloys-Chemical compositions and forms lEC 61190-1-3: 2010 Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications (overall evaluation: MOD) In addition, symbols which denote the degree of correspondence in the contents between the relevant International Standard and JIS are IDT (identical), MOD (modified), and NEQ (not equivalent) according to ISO/ IEC Guide 21-1. | |
| language | English | |
| title | JSA JIS Z 3282 | num |
| title | Soft solders - Chemical compositions and forms | en |
| type | standard | |
| page | 22 | |
| status | Active | |
| tree | JSA - Japanese Standards Association:;2017 | |
| contenttype | fulltext |