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Lessons Learned – Thermal Design Practices for Electronic Assemblies

contributor authorNASA - National Aeronautics and Space Administration (NASA)
date accessioned2017-09-04T18:21:09Z
date available2017-09-04T18:21:09Z
date copyright04/06/2000
date issued2000
identifier otherHYCEQCAAAAAAAAAA.pdf
identifier urihttp://yse.yabesh.ir/std;jsery=autho162s7D8308/handle/yse/203635
description abstractPractice:
Insure that thermal design practices for electronic assemblies will meet the requirements of the combined ground and flight environmental conditions defined by the spacecraft mission. Special emphasis should be placed on limiting the junction temperature of all active components. Proper thermal design practices take into consideration the need for ease of operation and repairability to enhance overall system reliability. The environmental conditions that the spacecraft encounters, both on the ground and in flight, are designed to include adequate margin. The use of proper thermal design practices ensures that the assemblies will survive the expected environmental conditions.
languageEnglish
titleNASA-LLIS-0768num
titleLessons Learned – Thermal Design Practices for Electronic Assembliesen
typestandard
page3
statusActive
treeNASA - National Aeronautics and Space Administration (NASA):;2000
contenttypefulltext


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