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NASA-LLIS-0768
Lessons Learned – Thermal Design Practices for Electronic Assemblies
Year: 2000
Abstract: Practice:
Insure that thermal design practices for electronic assemblies will meet the requirements of the combined ground and flight environmental conditions defined by the spacecraft mission. Special emphasis should be placed on limiting the junction temperature of all active components. Proper thermal design practices take into consideration the need for ease of operation and repairability to enhance overall system reliability. The environmental conditions that the spacecraft encounters, both on the ground and in flight, are designed to include adequate margin. The use of proper thermal design practices ensures that the assemblies will survive the expected environmental conditions.
Insure that thermal design practices for electronic assemblies will meet the requirements of the combined ground and flight environmental conditions defined by the spacecraft mission. Special emphasis should be placed on limiting the junction temperature of all active components. Proper thermal design practices take into consideration the need for ease of operation and repairability to enhance overall system reliability. The environmental conditions that the spacecraft encounters, both on the ground and in flight, are designed to include adequate margin. The use of proper thermal design practices ensures that the assemblies will survive the expected environmental conditions.
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| contributor author | NASA - National Aeronautics and Space Administration (NASA) | |
| date accessioned | 2017-09-04T18:21:09Z | |
| date available | 2017-09-04T18:21:09Z | |
| date copyright | 04/06/2000 | |
| date issued | 2000 | |
| identifier other | HYCEQCAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D8308/handle/yse/203635 | |
| description abstract | Practice: Insure that thermal design practices for electronic assemblies will meet the requirements of the combined ground and flight environmental conditions defined by the spacecraft mission. Special emphasis should be placed on limiting the junction temperature of all active components. Proper thermal design practices take into consideration the need for ease of operation and repairability to enhance overall system reliability. The environmental conditions that the spacecraft encounters, both on the ground and in flight, are designed to include adequate margin. The use of proper thermal design practices ensures that the assemblies will survive the expected environmental conditions. | |
| language | English | |
| title | NASA-LLIS-0768 | num |
| title | Lessons Learned – Thermal Design Practices for Electronic Assemblies | en |
| type | standard | |
| page | 3 | |
| status | Active | |
| tree | NASA - National Aeronautics and Space Administration (NASA):;2000 | |
| contenttype | fulltext |