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IPC TM-650 2.4.34.3
Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
Organization:
IPC - Association Connecting Electronics Industries
Year: 1995
Abstract: This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise.
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IPC TM-650 2.4.34.3
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-09-04T17:05:12Z | |
| date available | 2017-09-04T17:05:12Z | |
| date copyright | 01/01/1995 | |
| date issued | 1995 | |
| identifier other | BYMPCAAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/128735 | |
| description abstract | This test specifies a standard procedure for determining the viscosity of solder paste in the range of 50,000 to 300,000 centipoise. | |
| language | English | |
| title | IPC TM-650 2.4.34.3 | num |
| title | Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise) | en |
| type | standard | |
| page | 2 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;1995 | |
| contenttype | fulltext |