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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 101-120 of 793
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IPC 2581B
Abstract: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and ... -
IPC TM-650 2.4.1.2
Abstract: This method is to determine the adhesion or bonding quality of conductors on hybrid substrates. -
IPC 4411A
Abstract: This specification covers the requirements for nonwoven para-aramid reinforcement used in the manufacture of base materials primarily for rigid or multilayer printed boards in electrical and electronic applications. -
IPC TR-578
Abstract: OBJECTIVE
The "Program For Round Robin Evaluation of High Density, Double-Sided Copper Only (fine line, small plated-through hole) Printed Wiring Boards" has the following objectives:- To ...
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IPC 9631
Abstract: Purpose
The IPC-TM-650, Method 2.6.27, is intended to establish a relative ability of printed boards, or representative coupons, to survive the thermal excursions associated with assembly and rework ... -
IPC SMC-WP-005
Abstract: INTRODUCTION
The acceptance and use of Organic Solderability Preservatives (aSPs) as replacements for Hot Air Solder Leveling (HASL) continues to grow. aSPs selectively protect and maintain the ...Subject(s) : PWB soldering , surface finish , wire bonding , -
IPC 6013C
Abstract: This specification covers qualification and performance requirements of flexible printed boards. The flexible printed board may be single-sided, double-sided, multilayer, or rigid-flex multilayer. All of these constructions ... -
IPC A-610E HEBREW
Abstract: This standard is a collection of visual quality acceptability requirements for electronic assemblies.
This document presents acceptance requirements for the manufacture of electrical and electronic assemblies. Historically, ... -
IPC D-325A
Abstract: This standard establishes requirements and other considerations for the documentation of printed boards and printed board assemblies.
Purpose
The purpose of this standard is to establish the general ... -
IPC 2222A
Abstract: This standard establishes the specific requirements for the design of rigid organic printed boards.
Purpose The requirements contained herein are intended to establish specific design details that ... -
IPC 2576
Abstract: This standard covers the sectional requirements for product genealogy, or as-built manufacturing information. The standard facilitates the exchange of manufacturing information between supply chain partners to support ... -
IPC TM-650 2.5.5.1B
Abstract: This method describes a technique to determine the volume permittivity (dielectric constant) and loss tangent (dissipation factor) of insulating materials at 1 MHz using contacting electrodes. Several techniques are described ... -
IPC TM-650 2.3.3A
Abstract: This method is designed for use in determining the chemical resistance of all substrates and plastic materials in PWBs. -
IPC TR-486
Abstract: The scope of this test program includes a study of the repeatability and reproducibility of IST and thermal stress test method to determine the presence of inner-layer separations, development of guidelines for the use of ...