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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 121-140 of 793
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IPC TM-650 2.3.7.1A
Abstract: This method is a means for preparation of test specimens for determination of bare dielectric material quality and properties, using cupric chloride as the etching solution for removal of copper cladding. -
IPC MB-380
Abstract: This document was created to increase general understanding of molded interconnect technology. Information on candidate materials, molding processes, fabrication processes and test methods is included for suppliers, ... -
IPC TM-650 2.4.52
Abstract: This test method establishes a procedure for characterizing the toughness of the resin system materials used in making laminates for the fabrication of printed wiring boards. The single-edge-notch bending (SENB) geometry ... -
IPC TM-650 2.3.2G
Abstract: To determine the effect of chemicals used in printed board fabrication on metal-clad and bare flexible dielectric materials. Caution: This test method uses hazardous chemicals to generate data. The person implementing this ... -
IPC TM-650 2.1.9
Abstract: To visually locate, and feel, evaluate surface scratches during visual inspection.
If more exacting data is required for referee evaluations of microsectioning per IPC-TM-650, method 2.1.1 shall be used. -
IPC IPC/JPCA-4104
Abstract: This document describes various materials that can be used for the fabrication of high density interconnection (HDI) and microvias. It provides information on general classifications and associated characteristics of HDI ... -
IPC JPCA-2291
Abstract: This guideline provides an overview of the design process flow for printed electronics based devices, modules and units, and final products.
Purpose
The purpose is to present the framework of the ... -
IPC 1071A
Abstract: Purpose
The purpose of this standard is to assist printed board (PB) manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, ... -
IPC 2582
Abstract: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and ... -
IPC TA-722
Abstract: "An Introduction to Soldering"
By R.J. Klein Wassink, Phillips Center for Manufacturing Technology, Eindoven, The Netherlands
This article reviews various aspects of soldering as they relate to ... -
IPC TM-650 2.4.16A
Abstract: This method covers the determination of the force required to initiate tearing in flexible insulating materials. It is based on ASTM D-1004-66 (1970). -
IPC 1131
Abstract: This document is intended to provide a blueprint of key integrated information technology (IT) areas to help PWB manufacturers effectively and efficiently operate their businesses.
Purpose
The ... -
IPC TM-650 2.3.33D
Abstract: This qualitative test method is designed to determine the presence of chlorides and bromides in soldering flux by visual examination after placement on test paper. -
IPC 4202A
Abstract: This standard establishes the classification system, the qualification and quality conformance requirements for flexible base dielectric materials to be used for the fabrication of flexible printed circuitry and flexible ... -
IPC D-390A
Abstract: This guide is a general overview of Computer Aided Design and its processes, techniques, considerations and problem areas with respect to printed circuit design. -
IPC D-354
Abstract: The information contained in this standard is intended to supplement the IPC-D-350 through IPC-D-353 standard series. This document describes the usage of libraries within the processing and generation of information files. ... -
IPC 9701A CHINESE
Abstract: This specification establishes specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies. It further establishes different levels of performance and ... -
IPC 9851
Abstract: The purpose of this standard is to provide an equipment interface specification for board transfer manufacturing systems of surface-mounted printed circuit boards. This specification provides the minimum requirement that ...