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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 161-180 of 793
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IPC HDBK-630
Abstract: This document has been written to assist the designers, manufacturers and end users of electronic enclosures of electrical and electronic equipment to understand the best practices to meet requirements, ensuring the ... -
IPC 1758
Abstract: This standard establishes the requirements for exchanging packing declarations between members of a supply chain. Section 3.1 Terms and Definitions defines "packing." Although this standard contains only generic information ... -
IPC TM-650 2.2.16.1
Abstract: This test method is used to evaluate 1:1 artwork masters for layer to layer registration, conductor to edge spacing, screened nomenclature positioning, and solder mask to conductor relationships. -
IPC TM-650 2.3.32D
Abstract: This test method is designed to determine the removal effect the flux has (if any) on the bright copper mirror film which has been vacuum deposited on clear glass. -
IPC TM-650 2.4.28B
Abstract: This test method defines the procedure for determining the adhesion of solder masks used over nonmelting metals such as copper, gold, nickel, and tin printed wiring boards, both prior to and after soldering. -
IPC TM-650 2.2.5A
Abstract: This test method is to describe the procedures to be used for performing dimensional inspections on microsections of printed boards. This method does not apply to measurements less than 1.25 µm (0.00005 in). This ... -
IPC OI-645
Abstract: This standard establishes the requirements, definitions, and certification provisions for optical inspection aids and defines inspection grades that can be used as accept/reject criteria for the instrumentation used in an ... -
IPC TM-650 2.4.22.1C
Abstract: This method covers the measurement of bow and twist by maximum vertical displacement of an unrestrained panel of either cut to size panels or finished rigid printed boards including single- and double-sided, multilayer, ... -
IPC 2612-1
Abstract: This standard establishes the requirements for generation of electronic symbols used in the documentation of electronic diagrams that define the electrical interconnectivity of electronic parts. The descriptions pertain ... -
IPC TM-650 2.4.27.1B
Abstract: This method is designed to evaluate the resistance of solder mask or conformally coated surfaces to rubbing abrasion. -
IPC TM-650 2.5.5.10
Abstract: This test method describes procedure for measuring dielectric permittivity and loss tangent of embedded passive materials. The measurements are made in an APC-7 coaxial configuration where the test specimen represents a ... -
IPC TM-650 2.5.33
Abstract: EOS and electrostatic discharge (ESD) have been proven to damage and degrade electronic components and assemblies. This test method consists of a series of individual test procedures to test soldering and desoldering hand ... -
IPC 4121
Abstract: Purpose
This specification defines guidelines for selecting core constructions in terms of fiberglass fabric style and configuration for use in multilayer PWB applications. Each core construction is ... -
IPC D-422
Abstract: Introduction
This general design guide for Printed Board Backplanes is based upon the primary understanding that the individual using this IPC document as a reference and guide has the basic mechanical ... -
IPC TP-1113
Abstract: Introduction
In the early 1970's the only fluxes permissible for electronics manufacturing for military applications were types R (pure rosin only) and RMA (rosin based, mildly activated). Before ... -
IPC TM-650 2.3.36
Abstract: This test is a method for determining acid acceptance of chlorinated solvents. Acid acceptance is applicable for evaluating the condition of the following inhibited chlorinated solvents. Perchloroethylene 1,1,1-Trichloroethane ... -
IPC 4781
Abstract: This specification shall define the criteria for and method of obtaining the maximum information about and confidence in legend and marking ink material under evaluation.
This specification covers the following legend ...