Abstract: This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).

Abstract: This document describes a PWB fabrication data quality rating system used by fabricators to evaluate the incoming data package integrity. Printed board designers can also use this system as an output quality check.

Abstract: This method is designed to determine the resin content of a prepreg without removing the resin from the reinforcement. The basis weight of the fabric must be known. This method is applicable to both organic and inorganic ...

Abstract: Purpose
The purpose of this document is to define a Process Capability, Quality, and Relative Reliability (PCQR²) Benchmark Test Standard and Database subscription system for the evaluation ...

Abstract: This method describes the test procedures required to measure the characteristic impedance of flat cables. To keep this test method as simple and straightforward as possible, balanced and differential signal lines are not ...

Abstract: This test method is designed to determine volume resistivity and surface resistivity of metallic-clad or unclad laminates under conditions of specified humidity and temperature and at elevated temperatures.

Abstract: This standard establishes the requirements for the documentation of printed circuit board fabrication, and identifies the physical attributes and performance requirements of the unpopulated product. The descriptions apply ...

Abstract: This guideline describes the general provisions for implementation of SPC and is intended for use by individuals in electronics and other industries involved in the planning, implementation, and evaluation of an SPC system. ...

Abstract: This method is used to determine warp and fill thread count in materials containing combustible fibers.