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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 21-40 of 793
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IPC A-600J
Abstract: Scope: This document describes the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set ... -
IPC A-610F W/AMD 1
Abstract: Scope: This standard is a collection of visual quality acceptability requirements for electronic assemblies. This standard does not provide criteria for cross-section evaluation This document presents acceptance requirements ... -
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IPC 1401
Abstract: Scope: This standard specifies the requirements and guidance for a supply chain social responsibility management system that an enterprise can use to integrate social responsibility into products and its life cycle, as ... -
IPC 6018CS
Abstract: Scope: This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018C to ensure the reliability of printed boards that must survive the vibration, ground testing, ... -
IPC 2581B-WAM1
Abstract: Scope: This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, ... -
IPC J-STD-001FS
Abstract: Scope: This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001F with Amendment 1 to ensure the reliability of soldered electrical and electronic assemblies ... -
IPC 6012DA
Abstract: Scope: This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6012D to ensure the reliability of printed boards that must survive the vibration and thermal ... -
IPC HDBK-001F
Abstract: Scope: This Handbook is a companion reference to the J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies (Standard) and is intended to provide supporting information. Additional detailed information ... -
IPC IPC/JEDEC-9706
Abstract: This document establishes metrology guidelines to electrically and reliably detect solder joint opens on Flip-Chip Ball Grid Array (FCBGA) SMT board assemblies during the mechanical shock or drop event. In-situ metrology ... -
IPC QE-605A
Abstract: INTRODUCTION
‘‘QUALITY’’ is a term used in such a variety of contexts and applications, that it is not a simple matter to define.
• For some it means THE VERY BEST PRODUCT ... -
IPC 4811
Abstract: This document describes materials that can be used for the fabrication of embedded resistor devices within the finished printed circuit board substrate. It provides information on general classifications and associated ... -
IPC TM-650 2.4.22C
Abstract: This test method covers three procedures used to determine the bow and twist percentage of individual rigid printed boards, rigid portions of rigid-flex printed boards, and/or multiple printed panels. Measurements on ... -
IPC 6016
Abstract: This specification establishes the specific requirements for organic high-density interconnect (HDI) layers with microvia technology and the quality and reliability assurance requirements that must be met for their ... -
IPC TM-650 2.2.21
Abstract: The object of a planarity measurement is to determine the effectiveness of a polymer thin film in smoothing topological features created by underlying layers of circuitry or etch patterns. In this case, the polymer thin ...