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IPC J-STD-001FS
English -- Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies - Incorporates Amendment 1: February 2016
Organization:
IPC - Association Connecting Electronics Industries
Year: 2017
Abstract: Scope: This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001F with Amendment 1 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specifically identified requirements of J-STD-001F with Amendment 1.
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IPC J-STD-001FS
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| contributor author | IPC - Association Connecting Electronics Industries | |
| date accessioned | 2017-10-18T10:56:08Z | |
| date available | 2017-10-18T10:56:08Z | |
| date copyright | 2017.01.01 | |
| date issued | 2017 | |
| identifier other | GWHIUFAAAAAAAAAA.pdf | |
| identifier uri | http://yse.yabesh.ir/std;jsery=autho162s7D83081DAC426159DD6EFDEC014A/handle/yse/232575 | |
| description abstract | Scope: This Addendum provides requirements to be used in addition to, and in some cases, in place of, those published in J-STD-001F with Amendment 1 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic environments getting to and operating in space. Purpose When required by procurement documentation/drawings, this Addendum supplements or replaces specifically identified requirements of J-STD-001F with Amendment 1. | |
| language | English | |
| title | IPC J-STD-001FS | num |
| title | English -- Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies - Incorporates Amendment 1: February 2016 | en |
| type | standard | |
| page | 36 | |
| status | Active | |
| tree | IPC - Association Connecting Electronics Industries:;2017 | |
| contenttype | fulltext |