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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 281-300 of 793
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IPC TP-1114
Abstract: Introduction
Electronics manufacturers are faced with the difficult task of proving that a candidate manufacturing process can produce acceptable hardware, either to the customer of the product, or for ... -
IPC TM-650 2.3.27.1
Abstract: This High Performance Liquid Chromatography (HPLC) procedure outlines the analysis of rosin flux residues remaining on a printed wiring board (PWB) after defluxing. This test can be used for the evaluation of processes ... -
IPC TM-650 2.3.17D
Abstract: This test method is designed to measure the Resin Flow Percent by weight in prepreg. -
IPC TM-650 2.5.32
Abstract: To determine the change in resistance of plated through-holes after being subjected to repeated thermal cycling conditions. -
IPC TM-650 2.6.3.5
Abstract: This test method is used to characterize the cleanliness of printed wiring board fabrication processes by determining the degradation of electrical insulation resistance under conditions of high temperature and humidity. ... -
IPC TM-650 2.3.6A
Abstract: To determine the quality of the dielectric material after etching with ammonium persulfate. -
IPC 2612
Abstract: This standard establishes the requirements for the documentation of electronic diagrams used as the foundation for defining the electrical interconnectivity of electronic parts. The description pertains to either schematic ... -
IPC TM-650 2.6.3.4A
Abstract: This test method is used to determine the moisture and insulation resistance of applied conformal coating under prescribed conditions of temperature and humidity. Raw material qualification testing is performed on designated ... -
IPC TM-650 2.3.34.1B
Abstract: This test method provides a measurement of the flux percentage on flux-coated and/or in flux-cored solder. -
IPC A-610D FINNISH
Abstract: Tämä standardi koostuu elektroniikkavalmisteiden visuaaliseen laatuun liittyvistä hyväksymisvaatimuksista. Tässä dokumentissa esitetään sähkö- ja elektroniikkavalmisteiden ... -
IPC 5703
Abstract: Introduction In many IPC standards development meetings, those individuals responsible for assessing the quality of incoming unpopulated printed boards have lamented the fact that bare printed board ... -
IPC 4552
Abstract: This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses ... -
IPC TM-650 2.4.25C
Abstract: This test method is designed to determine the glass transition temperature of dielectric materials used in printed boards by differential scanning calorimetry (DSC). It is suitable for prepreg, metallic clad or unclad ... -
IPC TM-650 2.4.24.2
Abstract: This test method establishes a procedure for determining the glass transition temperature of organic films using dynamic mechanical analysis (DMA). -
IPC TM-650 2.3.35.2A
Abstract: This test method is used to determine the concentration of fluorides in soldering flux. The fluoride content is reported as the weight percentage of fluoride to the nonvolatile portion of the flux. Ion specific electrodes ... -
IPC 5701
Abstract: If you are in the electronics industry, at one time you have, will, or should wrestle with the issue of the cleanliness of the unpopulated printed circuit boards (bare boards). Residues on circuit boards are directly related ... -
IPC TM-650 2.4.18B
Abstract: To determine the tensile strength (in PSI) and the elongation (in percentage) of copper foil at ambient and elevated temperatures by mechanical force testing.