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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 301-320 of 793
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IPC CA-821
Abstract: This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board. -
IPC CMDD
Abstract: Introduction
Armed conflict and human rights abuses in the Democratic Republic of the Congo (DRC) have been linked to revenues derived from the mining and trading of the "conflict minerals" — ... -
IPC TM-650 2.3.24
Abstract: This test method provides procedures to determine the porosity of gold plating on both copper and nickel surfaces by chemical means. This method may also be used to test rhodium or palladium. -
IPC TM-650 2.6.1.1
Abstract: The fungus resistance test is used to determine the resistance of materials to fungi and to determine if such material is adversely affected by fungi under conditions favorable for their development, namely high humidity, ... -
IPC PE-740A
Abstract: PURPOSE AND FORMAT
The purpose of this Handbook is to provide guidance in the form of troubleshooting examples, process cause and effect information and statistical methods for correcting problems in ... -
IPC J-STD-006C
Abstract: This standard prescribes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ... -
IPC TM-650 2.6.11D
Abstract: This test method is used to determine the resistance of the applied solder mask to reverting to liquid when exposed to high humidity at a specific time and temperature condition. This test method evaluates the stability ... -
IPC 2221A GERMAN
Abstract: Dieses Normenwerk legt die allgemeinen Anforderungen für das Design von Leiterplatten aus organischen Materialien sowie anderen Formen der Bauteilbefestigung oder Verbindungsstrukturen fest. Die Materialien können ... -
IPC TM-650 2.5.14A
Abstract: Purpose: This test method covers procedures for determining the electrical resistivity of copper foil. It provides for an accuracy of ± 0.30 percent of test specimens having a resistance of 0.00001 ohm (10 microhms) ... -
IPC TM-650 2.5.19A
Abstract: This method describes the test procedures required to measure propagation delay in flat cables. Propagation delay is defined as the time required for a pulse to traverse a unit length of cable. Excessive propagation delay ... -
IPC TM-650 2.5.2A
Abstract: The purpose of this test is to measure the capacitance effects arising from plastic substrates, adhesives, or coatings, which may be critical to the reliable functioning of a circuit. -
IPC 9591
Abstract: Statement of Scope This document will standardize the Performance Parameters for Air Moving Devices. The phrase ‘‘Air Moving Device'' (or ‘‘Air Mover'') refers to equipment such as, ... -
IPC TM-650 2.4.45
Abstract: Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow. -
IPC TM-650 2.4.18.3
Abstract: This test method establishes a procedure for determining the tensile strength, elongation and Young's modulus of organic free films. -
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IPC 6012B ITALIAN
Abstract: Dichiarazione degli obiettivi Questa specifica riguarda la qualificazione ed i requisiti dei circuiti stampati rigidi. I circuiti stampati possono essere monofaccia, doppiafaccia con o senza fori metallizzati. I circuiti ... -
IPC TM-650 2.3.13A
Abstract: This test method specifies two methods for the determination of the acid value of a flux of type L, M or H. Method A is a potentiometric titration method and is to be considered the reference method. Method B is an ...