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IPC - Association Connecting Electronics Industries: Recent submissions
Now showing items 341-360 of 793
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IPC A-610E GERMAN
Abstract: Diese Richtlinie ist eine Zusammenstellung von Abnahmekriterien für die visuelle Inspektion elektronischer Baugruppen. Dieses Dokument präsentiert Abnahmeanforderungen für die Herstellung elektrischer und ... -
IPC TM-650 2.6.3.7
Abstract: This test method is used to quantify the deleterious effects of fabrication, process or handling residues on Surface Insulation Resistance (SIR) in the presence of moisture. The electrodes are long parallel traces (printed ... -
IPC IPC/JPCA-2315
Abstract: This document describes various via formations, materials, and design guidelines used in high density interconnects (HDI) and microvias. Microvias are processed/plated holes ≤0.15 mm in diameter.
Introdu ... -
IPC TM-650 2.6.9.2
Abstract: The purpose of this test method is to provide a consistent procedure to test the sensitivity of electronic components to ultrasonic energy. There has been reluctance in the electronics industry to use ultrasonic energy for ... -
IPC TM-650 2.5.5.3C
Abstract: Purpose: This method is suitable for determining the volume permittivity, (dielectric constant) and loss tangent (dissipation factor) of insulating materials at 1 MHz. It is not dependent on either direct or indirect ... -
IPC ML-960
Abstract: This specification covers qualification and performance of rigid mass laminated panels for use in multilayer printed boards. -
IPC 7711B/7721B POLISH
Abstract: This document covers procedures for repairing and reworking printed board assemblies. It is an aggregate of information collected, integrated and assembled by the Repairability Subcommittee (7-34) of the Product Assurance ... -
IPC TM-650 2.4.34.4
Abstract: This test method is designed to measure the viscosity of paste flux. -
IPC 9202
Abstract: Scope/Introduction This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It ... -
IPC TM-650 2.3.1
Abstract: This test method covers acceptance of incoming copper clad epoxy-glass laminates ranging in thickness from 0.8 mm to 6.5 mm, clad on one or both sides. It provides for a standard method of inspection and establishes ... -
IPC TM-650 2.1.1.2A
Abstract: This procedure is an alternate method for preparing multiple metallographic specimen(s) using microsection equipment. The specimen(s) is(are) for evaluation for quality of the laminate system, plated-through holes (PTHs), ... -
IPC TM-650 2.6.3.3B
Abstract: This test method is to characterize fluxes by determining the degradation of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. This test is carried out at high ... -
IPC IPC/JEDEC J-STD-020D.1
Abstract: This classification procedure applies to all nonhermetic solid state Surface Mount Devices (SMDs) in packages, which, because of absorbed moisture, could be sensitive to damage during solder reflow. The term SMD as used ... -
IPC TM-650 2.4.35
Abstract: This procedure determines vertical and horizontal slump for solder pastes. -
IPC IPC/JEDEC-9707
Abstract: This standard specifies a common method of establishing strain limits of board-level device interconnects under spherical bending conditions, the worst-case flexure condition that can occur during conventional printed ... -
IPC TM-650 2.4.4B
Abstract: This test is designed to determine the flexural strength of laminates of thicknesses greater than, or equal to, 0.51 mm [0.020 in] by applying a specific load to a specific size and shaped specimen. -
IPC J-STD-001D ROMANIAN
Abstract: This standard prescribes practices and requirements for the manufacture of soldered electrical and electronic assemblies. Historically, electronic assembly (soldering) standards contained a more comprehensive tutorial ...